論文- 三浦 英生 -
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件数:64件
[2011]
1.Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps.[ASME InterPACK2011,IPACK2011-52063,(2011),1-6]Kota Nakahira, Hironori Tago, Ken Suzuki, Hideo Miura, Fumiaki Endo
2.Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-dispersed Resin.[ASME InterPACK2011,IPACK2011-52062,(2011),1-6]Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
3.Stress-Induced and Electro-migration of Electroplated Copper Thin Films Used for 3D Integration.[ASME InterPACK2011,IPACK2011-52058,(2011),1-6]Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
4.Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections.[ASME InterPACK2011,IPACK2011-52048,(2011),1-8]Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
5.Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin under Strain.[ASME InterPACK2011,IPACK2011-52064,(2011),1-6]Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura
6.Change of the Electronic Conductivity of Carbon Nanotubes and Grapheme Sheets Caused by a Three-Dimensional Strain Field.[ASME InterPACK2011,IPACK2011-52057,(2011),1-6]Masato Ohnishi, Ken Suzuki, Hideo Miura, Yusuke Suzuki, Yusuke Ohashi
7.Micro Texture Dependence of the Mechanical and Electrical Reliability of Electroplated Copper Thin Film Interconnections.[IEEE 61st Electronic Components&Technology Conference 2011,(2011),2119-2125]Naokazu Murata, Naoki Saito, Fumiaki Endo, Kinji Tamakawa, Ken Suzuki, and Hideo Miura
8.Mechanical and Electrical Reliability of Electroplated Copper Thin Film Interconnections.[International Conference on Electronics Packaging,(2011),154-159]Naokazu Murata, Naoki Saito, Fumiaki Endo, Kinji Tamakawa, Ken Suzuki, and Hideo Miura
9.Stress-induced Migration of the Electroplated Copper Thin Film Interconnection.[International Conference on Electronics Packaging,(2011),871-874]Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, and Hideo Miura
10.Monitoring Method of Residual Stress in a Substrate During Thin Film Processing.[International Conference on Electronics Packaging,(2011),853-856]Kota Nakahira, Hironori Tago, Hiroki Kishi, Ken Suzuki, and Hideo Miura
11.Evaluation of the Change of the Residual Stress in Nano-scale Transistors During the Deposition and Fine Patterning Processes of Thin Films.[Proc. of EuroSimE 2011,12(P16),(2011),1-6]Kota Nakahira, Hironori Tago, Hiroki Kishi, Ken Suzuki, Hideo Miura, Masaki Yoshimaru and Ken-ichiro Tatsuuma
[2010]
12.Micro Texture Dependence of Both the Mechanical and Electrical Properties of Electroplated Copper Thin Films Used for Interconnection.[ASME International Mechanical Engineering Congress and Exposition,IMECE2010-37279,(2010),1-6]Naokazu Murata, Naoki Saito, Kinji Tamakawa , Ken Suzuki, Hideo Miura
13.Nanostructure Dependence of the Electronic Conductivity of Carbon Nanotubes and Grapheme Sheets.[ASME International Mechanical Engineering Congress and Exposition,IMECE2010-37277,(2010),1-6]Masato Ohnishi, Katsuya Ohsaki, Yusuke Suzuki, Ken Suzuki, Hideo Miura
14.High-Temperature Damages of Ni-Base Superalloy Caused by the Change of Nanotexture Due to Strain-Induced Anisotropic Diffusion.[ASME International Mechanical Engineering Congress and Exposition,IMECE2010-37284,(2010),1-6]Yamato Sasaki, Hiroyuki Itoh, Naokazu Murata, Ken Suzuki, Hideo Miura
15.NONDESTRUCTIVE DETECTION OF OPEN FAILURES IN THREE-DIMENSIONALLY STACKED CHIPS MOUNTED BY AREA-ARRAYED FINE BUMPS.[12th International Conference on Electronics Materials and Packaging,12,(2010),117-123]Yuki Sato, Kohta Nakahira, Naokazu Murata, Ken Suzuki, and Hideo Miura
16.MEASUREMENT OF THE LOCAL RESIDUAL STRESS BETWEEN FINE METALLIC BUMPS IN 3D FLIP CHIP STRUCTURES.[12th International Conference on Electronics Materials and Packaging,12,(2010),137-142]Kohta Nakahira, Hironori Tago, Takuya Sasaki, Ken Suzuki, and Hideo Miura
17.REMOTE DYNAMIC STRAIN MEASUREMENT USING VERTICAL CAVITY SURFACE EMITTING LASER.[12th International Conference on Electronics Materials and Packaging,12,(2010),131-136]Yusuke Ohashi, Aya Kaisumi, Atsushi Kitamura, Ken Suzuki, and Hideo Miura
18.Improvement of the Interface Integrity between a High-k Dielectric Film and a Metal Gate Electrode by Controlling Point Defects and Residual Stress.[15th International Conference on Simulation of Semiconductor Processes and Devices,12B1,(2010),213-216]Ken Suzuki, Tatsuya Inoue, and Hideo Miura
19.Nondestructive Evaluation of the Delamination of Fine Bumps in Three-Dimensionally Stacked Flip Chip Structures.[Proc. of IEEE ECTC2010,(P272),(2010),1-7]Yuhki Sato, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, and Hideo Miura
20.Dominant Structural Factors of the Local Deformation and Residual Stress of a Silicon Chip Mounted on Area-Arrayed Flip Chip Structures.[Proc. of ICEP 2010,(2010),345-348]Kohta Nakahira, Naokazu Murata, Yuhki Sato, Ken Suzuki and Hideo Miura
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