著書論文等- 三浦 英生 -
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件数:89件
[2012]
1.[] パワーデバイス並びに環境・ エネルギーと信頼性技術.[エレクトロニクス実装学会 エレクトロニクス実装学会誌,15(5), (2012), 395-399]三浦 英生
2.[] 破壊力学大系.[(株)エヌティーエス,(2012)]服部敏雄,川田宏之,田川哲哉,東郷敬一郎,中井善一,三浦英生
[2011]
3.[] 機械実用便覧.[日本機械学会,(2011)]本阿彌真治(主査),他84名
4.[] Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps.[ASME InterPACK2011,IPACK2011-52063,(2011),1-6]Kota Nakahira, Hironori Tago, Ken Suzuki, Hideo Miura, Fumiaki Endo
5.[] Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-dispersed Resin.[ASME InterPACK2011,IPACK2011-52062,(2011),1-6]Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
6.[] Stress-Induced and Electro-migration of Electroplated Copper Thin Films Used for 3D Integration.[ASME InterPACK2011,IPACK2011-52058,(2011),1-6]Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
7.[] Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections.[ASME InterPACK2011,IPACK2011-52048,(2011),1-8]Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
8.[] Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin under Strain.[ASME InterPACK2011,IPACK2011-52064,(2011),1-6]Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura
9.[] Change of the Electronic Conductivity of Carbon Nanotubes and Grapheme Sheets Caused by a Three-Dimensional Strain Field.[ASME InterPACK2011,IPACK2011-52057,(2011),1-6]Masato Ohnishi, Ken Suzuki, Hideo Miura, Yusuke Suzuki, Yusuke Ohashi
10.[] ナノ・マイクロスケールの材料力学と強度信頼性.[日本機械学会 日本機械学会M&M2011,(8), (2011), 1-3]三浦 英生
11.[] 多結晶材料の結晶粒界品質測定と材料強度信頼性評価への適用.[日本学術振興会 先端材料強度129委員会,(104), (2011), 11-16]三浦 英生
12.[] Micro Texture Dependence of the Mechanical and Electrical Reliability of Electroplated Copper Thin Film Interconnections.[IEEE 61st Electronic Components&Technology Conference 2011,(2011),2119-2125]Naokazu Murata, Naoki Saito, Fumiaki Endo, Kinji Tamakawa, Ken Suzuki, and Hideo Miura
13.[] Mechanical and Electrical Reliability of Electroplated Copper Thin Film Interconnections.[International Conference on Electronics Packaging,(2011),154-159]Naokazu Murata, Naoki Saito, Fumiaki Endo, Kinji Tamakawa, Ken Suzuki, and Hideo Miura
14.[] Stress-induced Migration of the Electroplated Copper Thin Film Interconnection.[International Conference on Electronics Packaging,(2011),871-874]Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, and Hideo Miura
15.[] Monitoring Method of Residual Stress in a Substrate During Thin Film Processing.[International Conference on Electronics Packaging,(2011),853-856]Kota Nakahira, Hironori Tago, Hiroki Kishi, Ken Suzuki, and Hideo Miura
16.[] Evaluation of the Change of the Residual Stress in Nano-scale Transistors During the Deposition and Fine Patterning Processes of Thin Films.[Proc. of EuroSimE 2011,12(P16),(2011),1-6]Kota Nakahira, Hironori Tago, Hiroki Kishi, Ken Suzuki, Hideo Miura, Masaki Yoshimaru and Ken-ichiro Tatsuuma
[2010]
17.[] Micro Texture Dependence of Both the Mechanical and Electrical Properties of Electroplated Copper Thin Films Used for Interconnection.[ASME International Mechanical Engineering Congress and Exposition,IMECE2010-37279,(2010),1-6]Naokazu Murata, Naoki Saito, Kinji Tamakawa , Ken Suzuki, Hideo Miura
18.[] Nanostructure Dependence of the Electronic Conductivity of Carbon Nanotubes and Grapheme Sheets.[ASME International Mechanical Engineering Congress and Exposition,IMECE2010-37277,(2010),1-6]Masato Ohnishi, Katsuya Ohsaki, Yusuke Suzuki, Ken Suzuki, Hideo Miura
19.[] High-Temperature Damages of Ni-Base Superalloy Caused by the Change of Nanotexture Due to Strain-Induced Anisotropic Diffusion.[ASME International Mechanical Engineering Congress and Exposition,IMECE2010-37284,(2010),1-6]Yamato Sasaki, Hiroyuki Itoh, Naokazu Murata, Ken Suzuki, Hideo Miura
20.[] NONDESTRUCTIVE DETECTION OF OPEN FAILURES IN THREE-DIMENSIONALLY STACKED CHIPS MOUNTED BY AREA-ARRAYED FINE BUMPS.[12th International Conference on Electronics Materials and Packaging,12,(2010),117-123]Yuki Sato, Kohta Nakahira, Naokazu Murata, Ken Suzuki, and Hideo Miura
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