論文- 田中 秀治 -
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件数:579件
[2017]
1.On-chip electrochromic micro display for a disposable bio-sensor chip.[Journal of Micromechanics and Microengineering,27,(2017),125012-]Yanjun Zhu, Takashiro Tsukamoto, Shuji Tanaka
2.進化し続けるMEMSの技術と応用 ~ デバイス・モジュールメーカーとプラットフォーマーの時代 ~.[電子情報通信学会 集積化光デバイスと応用技術特別研究専門委員会, 第2回集積化光デバイスと応用研究会 -IoT時代の集積フォトニクス-,(2017)]田中秀治
3.Quad-seesaw-electrode type 3-axis tactile sensor with low nonlinearities and low cross-axis sensitivities.[Sensors and Actuators A,266,(2017),24-35]Yoshiyuki Hata, Yutaka Nonomura, Yoshiteru Omura, Takahiro Nakayama, Motohiro Fujiyoshi, Hirofumi Funabashi, Teruhisa Akashi, Masanori Muroyama, Shuji Tanaka
4.3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer.[Sensors,17,(2017),2451-]Sho Asano, Masanori Muroyama, Takahiro Nakayama, Yoshiyuki Hata, Yutaka Nonomura, Shuji Tanaka
5.Epitaxial PMnN-PZT/Si MEMS Ultrasonic Rangefinder with 2 m Range at 1 V Drive.[Sensors and Actuators A,266,(2017),352-360]Zhen Zhoua, Shinya Yoshida, Shuji Tanaka
6.Improved Quality Factor of Hetero Acoustic Layer (HAL) SAW Resonator Combining LiTaO3 Thin Plate and Quartz Substrate.[IEEE International Ultrasonics Symposium,(2017)]Michio Kadota, Shuji Tanaka
7.Stylus type MEMS texture sensor covered with corrugated diaphragm.[Journal of Micromechanics and Microengineering,27,(2017),95006-]Takashiro Tsukamoto, Hideaki Asao, Shuji Tanaka
8.A Tactile Sensor Network System Using a Multiple Sensor Platform with a Dedicated CMOS-LSI for Robot Applications.[Sensors,17,(2017),1947-]Chenzhong Shao, Shuji Tanaka, Takahiro Nakayama, Yoshiyuki Hata, Travis Bartley, Yutaka Nonomura, Masanori Muroyama
9.Wafer-level vacuum sealing using AgAg thermocompression bonding after fly-cut planarization.[Sensors and Actuators A,261,(2017),210-218]Cong Liu, Hideki Hirano, Joerg Froemel, Shuji Tanaka
10.Transient response of ALD-QCM with synchronized back pressure control of sensor head.[The AVS 17th International Conference on Atomic Layer Deposition (ALD 2017),(2017)]Masafumi Kumano, Kosuke Hikichi, Shuji Tanaka
11.Development of novel buffer layer structure for epitaxial growth of (100)/(001)Pb(Zr,Ti)O3-based thin film on (111)Si wafer.[Japanese Journal of Applied Physics,56,(2017),71501-]Takeshi Hayasaka, Shinya Yoshida, Shuji Tanaka
12.A 1.9 GHz Low-Phase-Noise Complementary Cross-coupled FBAR-VCO without Additional Voltage Headroom in 0.18 μm CMOS Technology.[IEICE Transactions on Electronics,E100-C(4),(2017),363-369]Guoqiang ZHANG, Awinash ANAND, Kousuke HIKICHI, Shuji TANAKA, Masayoshi ESASHI, Ken-ya HASHIMOTO, Shinji TANIGUCHI, Ramesh K. POKHAREL
13.圧電ムーニー型共振マイクロアクチュエータ.[電気学会論文誌E,137(4),(2017),95-100]藤村康浩, 塚本貴城, 田中秀治
14.System Development of Biosensing Module Using CMOS Hall Sensor Array for Disposable Wireless Diagnosis Device.[12th IEEE Internatinal Conference on Nano/Micro Engineered and Molecular Systems (IEEE-NEMS 2017),(2017),160-163]Tong Sun, Takashiro Tsukamoto, Tomohiro Ishikawa, Shuji Tanaka
15.Smart Sensors for Next Generation Robots.[The 12th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE-NEMS 2017),(2017)]Shuji Tanaka
16.Disposable Wireless Immuno-Sensing Chips.[International Journal of Automation and Smart Technology,7,(2017),1-6]T. Tsukamoto, T. Ishikawa, S. Tanaka
17.A wafer-level MEMS-LSI integration platform using fly-cut bonding metals customizable for diverse applications.[Smart Systems Integration 2017,(2017),151-158]Hideki Hirano, Yukio Suzuki, Chand Rakesh, Shuji Tanaka
18.Micro thermal diode with glass thermal insulation structure embedded in vapor chamber.[Journal of Micromechanics and Microengineering,27,(2017),45001-]Takashiro Tsukamoto, Takashi Hirayanagi, Shuji Tanaka
19.MEMS関連技術の新しい弾性波デバイスへの貢献.[圧電材料・デバイスシンポジウム2017,(2017),57-65]田中秀治
20.Low Temperature Hermetic Sealing by Aluminum Thermocompression Bonding using Tin Intermediate Layer.[2017 IEEE Electron Devices Technology and Manufacturing,(2017),219-221]S. Satoh, H. Fukushi, M. Esashi, S. Tanaka
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