論文- 田中 秀治 -
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件数:579件
[2017]
1.On-chip electrochromic micro display for a disposable bio-sensor chip.[Journal of Micromechanics and Microengineering,27,(2017),125012-]Yanjun Zhu, Takashiro Tsukamoto, Shuji Tanaka
2.進化し続けるMEMSの技術と応用 ~ デバイス・モジュールメーカーとプラットフォーマーの時代 ~.[電子情報通信学会 集積化光デバイスと応用技術特別研究専門委員会, 第2回集積化光デバイスと応用研究会 -IoT時代の集積フォトニクス-,(2017)]田中秀治
3.3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer.[Sensors,17,(2017),2451-]Sho Asano, Masanori Muroyama, Takahiro Nakayama, Yoshiyuki Hata, Yutaka Nonomura, Shuji Tanaka
4.Epitaxial PMnN-PZT/Si MEMS Ultrasonic Rangefinder with 2 m Range at 1 V Drive.[Sensors and Actuators A,266,(2017),352-360]Zhen Zhoua, Shinya Yoshida, Shuji Tanaka
5.Quad-seesaw-electrode type 3-axis tactile sensor with lownonlinearities and low cross-axis sensitivities.[Sensors and Actuators A,266,(2017),24-35]Yoshiyuki Hata, Yutaka Nonomura, Yoshiteru Omura, Takahiro Nakayama, Motohiro Fujiyoshi, Hirofumi Funabashi, Teruhisa Akashi, Masanori Muroyama, Shuji Tanaka
6.Improved Quality Factor of Hetero Acoustic Layer (HAL) SAW Resonator Combining LiTaO3 Thin Plate and Quartz Substrate.[IEEE International Ultrasonics Symposium,(2017)]Michio Kadota, Shuji Tanaka
7.Stylus type MEMS texture sensor covered with corrugated diaphragm.[Journal of Micromechanics and Microengineering,27,(2017),95006-]Takashiro Tsukamoto, Hideaki Asao, Shuji Tanaka
8.A Tactile Sensor Network System Using a Multiple Sensor Platform with a Dedicated CMOS-LSI for Robot Applications.[Sensors,17,(2017),1947-]Chenzhong Shao, Shuji Tanaka, Takahiro Nakayama, Yoshiyuki Hata, Travis Bartley, Yutaka Nonomura, Masanori Muroyama
9.Wafer-level vacuum sealing using AgAg thermocompression bonding after fly-cut planarization.[Sensors and Actuators A,261,(2017),210-218]Cong Liu, Hideki Hirano, Joerg Froemel, Shuji Tanaka
10.Transient response of ALD-QCM with synchronized back pressure control of sensor head.[The AVS 17th International Conference on Atomic Layer Deposition (ALD 2017),(2017)]Masafumi Kumano, Kosuke Hikichi, Shuji Tanaka
11.Development of novel buffer layer structure for epitaxial growth of (100)/(001)Pb(Zr,Ti)O3-based thin film on (111)Si wafer.[Japanese Journal of Applied Physics,56,(2017),71501-]Takeshi Hayasaka, Shinya Yoshida, Shuji Tanaka
12.A 1.9 GHz Low-Phase-Noise Complementary Cross-coupled FBAR-VCO without Additional Voltage Headroom in 0.18 μm CMOS Technology.[IEICE Transactions on Electronics,E100-C(4),(2017),363-369]Guoqiang ZHANG, Awinash ANAND, Kousuke HIKICHI, Shuji TANAKA, Masayoshi ESASHI, Ken-ya HASHIMOTO, Shinji TANIGUCHI, Ramesh K. POKHAREL
13.圧電ムーニー型共振マイクロアクチュエータ.[電気学会論文誌E,137(4),(2017),95-100]藤村康浩, 塚本貴城, 田中秀治
14.System Development of Biosensing Module Using CMOS Hall Sensor Array for Disposable Wireless Diagnosis Device.[12th IEEE Internatinal Conference on Nano/Micro Engineered and Molecular Systems (IEEE-NEMS 2017),(2017),160-163]Tong Sun, Takashiro Tsukamoto, Tomohiro Ishikawa, Shuji Tanaka
15.Smart Sensors for Next Generation Robots.[The 12th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE-NEMS 2017),(2017)]Shuji Tanaka
16.Disposable Wireless Immuno-Sensing Chips.[International Journal of Automation and Smart Technology,7,(2017),1-6]T. Tsukamoto, T. Ishikawa, S. Tanaka
17.A wafer-level MEMS-LSI integration platform using fly-cut bonding metals customizable for diverse applications.[Smart Systems Integration 2017,(2017),151-158]Hideki Hirano, Yukio Suzuki, Chand Rakesh, Shuji Tanaka
18.Micro thermal diode with glass thermal insulation structure embedded in vapor chamber.[Journal of Micromechanics and Microengineering,27,(2017),45001-]Takashiro Tsukamoto, Takashi Hirayanagi, Shuji Tanaka
19.MEMS関連技術の新しい弾性波デバイスへの貢献.[圧電材料・デバイスシンポジウム2017,(2017),57-65]田中秀治
20.Low Temperature Hermetic Sealing by Aluminum Thermocompression Bonding using Tin Intermediate Layer.[2017 IEEE Electron Devices Technology and Manufacturing,(2017),219-221]S. Satoh, H. Fukushi, M. Esashi, S. Tanaka
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