Researchers Information

Research Activities

Books, Original Papers & Review Papers
Graduate School of Engineering
Fracture and Reliability Research Institute
Division of Design and Evaluation of Function and Reliability of Materials
Laboratory for Prediction and Prevention of Fractures
Assigned Class
Graduate School of Engineering
Department of Finemechanics

Representative Chair of Division of Mechanical Engineering
Research Fields
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    Nano and micro structures, Optimum design of electronic functions and reliability, Explication of physical properties of nanostructures
    Academic Society Membership
    • The Insitute of Electrical and Electronics Engineers, Inc.
    • The Japan Society of Mechanical Engineering
    • Japan Institute of Electronics Packaging
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    Activity of Academic Society (Post)
    • American Society for Mechanical Engineers (ASME), Associate Editor of Journal of Electronic Packaging(2004)
    • エレクトロニクス実装学会, 理事(2006-2008)
    • InterPACK2007, Co-general Chair (Representative of JSME)(2005-2007)
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    Original Papers

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    Review Papers

    Activityb Report and Future Vision of thev Research Group of Explication of the Damage Mechanism of Materials in Nano Scale.[Japan Synchrotron Radiation Research Center SPring-8 Information,13(1), (2008), 56-62]Hideo Miura, Tetsuo Shoji

    ナノスケールの材料力学.[日本機械学会論文集(A編),72(717), (2006), 595-601]三浦 英生

    Evaluation of Strength and Reliability of Electronic Packages and Modules Based on Structural Analysis.[Japan Institute of Electronics Packaging Jourbnal of Japan Institute of Electronics Packaging,10(5), (2007), 427-432]三浦 英生

    エレクトロニクス実装構造信頼性の分析・計測技術.[エレクトロニクス実装学会誌,9(3), (2006), 152-156]三浦 英生

    Reversion to Analogical Thinking from Digital Thinking.[Japan Institute of Electronics Packaging Journal of Japan Institute of Electronics Packaging,10(3), (2007)]Hideo Miura

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    Honours, Awards and Prizes
    • 科学技術分野の文部科学大臣表彰 科学技術賞(研究部門)(2017)
    • 日本機械学会材料力学部門業績賞(2014)
    • Outstanding Poster Paper Award of IEEE 60th ECTC(2011)
    • Best Runner-Up Poster Award(2015)
    • Best Paper Award of the Japan Institute of Electronic Packaging(2010)
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