Researchers Information

Books, Original Papers & Review Papers
Graduate School of Engineering
Department of Mechanical Systems Engineering
Functional Systems Engineering
Associate Professor
Tohoku Univ, NICHe, Associate Professor
Academic Degree
Doctor in Engineering
Research Fields
  • Electron/electric material engineering
  • Electronic device/electronic equipment
  • Material processing/treatment
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3D-stacked LSI, Retina prosthesis, Implantable devices, Functional polymer, Microelectronics packaging, Flexible Hybrid Electronics (FHE)
Academic Society Membership
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    Activity of Academic Society (Post)
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      Original Papers

      Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration.[IEEE Transactions on Components, Packaging and Manufacturing Technology,8(10),(2018),1738-1746]Takafumi Fukushima, Arsalan Alam, Amir Hanna, Siva Chandra Jangam, Adeel Ahmad Bajwa, and Subramanian S. Iyer

      New Three-Dimensional Integration Technology Using Self-Assembly Technique.[IEEE International Electron Devices Meeting (IEDM) Technical Digest,(2005),359-362]T. Fukushima, Y. Yamada, H. Kikuchi, and M. Koyanagi

      New concept of positive photosensitive polyimide: Reaction development patterning (RDP).[JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY,34(19),(2001),3451-3463]Fukushima T, Oyama T, Iijima T, Tomoi M, Itatani H

      Surface-tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits.[APPLIED PHYSICS LETTERS,96,(2010),154105-1-154105-3]T. Fukushima, E. Iwata, T. Konno, J.-C. Bea, K.-W. Lee, T. Tanaka, and M. Koyanagi

      Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method.[IEEE International Electron Devices Meeting (IEDM) Technical Digest,(2009),349-352]Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, and Mitsumasa Koyanagi

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      Review Papers

      半導体ウエハへの三次元配線加工:TSVと狭ピッチ電極を中心に.[表面技術(小特集 シリコンウエハの表面処理),67(8), (2016), 414-420]福島誉史、李康旭、田中徹、小柳光正

      Heterogeneous Integration with High-Performance and Scalable Substrates: Si-IF (Interconnect Fabric) and FlexTrateTM.[Advancing Microelectronics Magazine,Mar./Apr., (2017)]T. Fukushima, A. Bajwa, and S.S.Iyer

      エンプラを感光性ポリマーに変える新原理:反応現像画像形成法.[マテリアルステージ,2(4), (2002), 90-96]大山俊幸, 福島誉史, 友井正男

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      Honours, Awards and Prizes
      • ドイツ・イノベーション・アワード 「ゴットフリード・ワグネル賞2009」the 2nd Prize(2010)
      • 田中貴金属 記念財団 貴金属に関わる研究助成 プラチナ賞 「ブロック高分子と金属ナノ粒子が創出する拡張誘導自己組織化配線に関する技術開発」(2017)
      • The 60th IEEE Electronic Components and Technology Conference (ECTC) Outstanding Session Paper Award(2011)
      • Material Research Society (MRS) Fall Meeting Invited Speaker Award(2008)
      • 第25 回エレクトロニクス実装学術講演大会 研究奨励賞(2012)
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